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| Chapter title |
Solder Joint Characterization
|
|---|---|
| Chapter number | 5 |
| Book title |
Assembly and Reliability of Lead-Free Solder Joints
|
| Published by |
Springer, Singapore, January 2020
|
| DOI | 10.1007/978-981-15-3920-6_5 |
| Book ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
| Authors |
John H. Lau, Ning-Cheng Lee, Lau, John H., Lee, Ning-Cheng |