You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output.
Click here to find out more.
Chapter title |
Prevailing Lead-Free Materials
|
---|---|
Chapter number | 2 |
Book title |
Assembly and Reliability of Lead-Free Solder Joints
|
Published by |
Springer, Singapore, January 2020
|
DOI | 10.1007/978-981-15-3920-6_2 |
Book ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
Authors |
John H. Lau, Ning-Cheng Lee, Lau, John H., Lee, Ning-Cheng |