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Mendeley readers
| Title |
Assembly and Reliability of Lead-Free Solder Joints
|
|---|---|
| Published by |
Springer Singapore, July 2020
|
| DOI | 10.1007/978-981-15-3920-6 |
| ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
| Authors |
Lau, John H., Lee, Ning-Cheng |
Mendeley readers
The data shown below were compiled from readership statistics for 27 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 27 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Researcher | 5 | 19% |
| Student > Ph. D. Student | 3 | 11% |
| Lecturer | 2 | 7% |
| Student > Master | 2 | 7% |
| Student > Bachelor | 1 | 4% |
| Other | 3 | 11% |
| Unknown | 11 | 41% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 6 | 22% |
| Engineering | 6 | 22% |
| Unspecified | 1 | 4% |
| Chemistry | 1 | 4% |
| Chemical Engineering | 1 | 4% |
| Other | 0 | 0% |
| Unknown | 12 | 44% |