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Nanopackaging: From Nanomaterials to the Atomic Scale

Overview of attention for book
Attention for Chapter 3: Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants
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Chapter title
Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants
Chapter number 3
Book title
Nanopackaging: From Nanomaterials to the Atomic Scale
Published by
Springer, Cham, January 2015
DOI 10.1007/978-3-319-21194-7_3
Book ISBNs
978-3-31-921193-0, 978-3-31-921194-7
Authors

R. Robles, M. Kepenekian, N. Lorente, Robles, R., Kepenekian, M., Lorente, N.