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MEMS and Nanotechnology, Volume 4

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Cover of 'MEMS and Nanotechnology, Volume 4'

Table of Contents

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    Book Overview
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    Chapter 1 Integrated process feasibility of hard-mask for tight pitch interconnects fabrication
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    Chapter 2 Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures
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    Chapter 3 Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon Nano-tubes Reinforced Epoxy
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    Chapter 4 A nano-tensile tester for creep studies
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    Chapter 5 The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing
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    Chapter 6 New Insight into Pile-up in Thin Film Indentation
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    Chapter 7 Measuring Substrate-Independent Young’s Modulus of Thin Films
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    Chapter 8 Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach
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    Chapter 9 Nano-indentation Studies of Polyglactin 910 Monofilament Sutures
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    Chapter 10 Analytical approach for the determination of nanomechanical properties for metals
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    Chapter 11 Advances in Thin Film Indentation
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    Chapter 12 Cyclic Nanoindentation Shakedown of Muscovite and Its Elastic Modulus Measurement
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    Chapter 13 Assessment of Digital Holography for 3D-Shape Measurement of Micro Deep Drawing Parts in comparison to Confocal Microscopy
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    Chapter 14 Full-Field Bulge Testing Using Global Digital Image Correlation
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    Chapter 15 Experimental Investigation of Deformation Mechanisms Present in Ultrafine-Grained Metals
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    Chapter 16 Characterization of a Variation on AFIT’s Tunable MEMS Cantilever Array Metamaterial
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    Chapter 17 MEMS for real-time infrared imaging
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    Chapter 18 New Insights into Enhancing Microcantilever MEMS Sensors
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    Chapter 19 A Miniature MRI-Compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer
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    Chapter 20 Micromechanical Structure With Stable Linear Positive And Negative Stiffness
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    Chapter 21 Terahertz Metamaterial Structures Fabricated by PolyMUMPs
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    Chapter 22 Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths
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    Chapter 23 MEMS integrated metamaterials with variable resonance operating at RF frequencies
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    Chapter 24 Creep measurements in free-standing thin metal film micro-cantilever bending
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    Chapter 25 MEMS Reliability for Space Applications by Elimination of Potential Failure Modes through Analysis
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    Chapter 26 Analysis and Evaluation Methods Associated with the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies
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    Chapter 27 Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-Based Luminaire
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    Chapter 28 Direct Determination of Interfacial Traction-Separation Relations in Chip-Package Systems
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Title
MEMS and Nanotechnology, Volume 4
Published by
Springer New York, May 2011
DOI 10.1007/978-1-4614-0210-7
ISBNs
978-1-4614-0209-1, 978-1-4614-0210-7
Editors

Proulx, Tom

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 36 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 36 100%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 1 3%
Unknown 35 97%
Readers by discipline Count As %
Engineering 1 3%
Unknown 35 97%