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Mendeley readers
Chapter title |
Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding
|
---|---|
Chapter number | 33 |
Book title |
Materials for Information Technology
|
Published by |
Springer, London, January 2005
|
DOI | 10.1007/1-84628-235-7_33 |
Book ISBNs |
978-1-85233-941-8, 978-1-84628-235-5
|
Authors |
J. -Q. Lu, T. S. Cale, R. J. Gutmann |
Mendeley readers
The data shown below were compiled from readership statistics for 8 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 8 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Master | 3 | 38% |
Lecturer | 1 | 13% |
Librarian | 1 | 13% |
Student > Doctoral Student | 1 | 13% |
Researcher | 1 | 13% |
Other | 0 | 0% |
Unknown | 1 | 13% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 5 | 63% |
Physics and Astronomy | 1 | 13% |
Unknown | 2 | 25% |