Fabric interconnection for memory banks based on network-on-chip methodology Grant US-11165717-B2 United States of America 02 Nov 2021
Multilayer 3D memory based on network-on-chip interconnection Application US-10243881-B2 United States of America 26 Mar 2019
Optimized semiconductor packaging in a three-dimensional stack Grant US-8476112-B2 United States of America 02 Jul 2013