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Mendeley readers
| Chapter title |
Thermal Via Insertion and Thermally Aware Routing in 3D ICs
|
|---|---|
| Chapter number | 6 |
| Book title |
Three Dimensional Integrated Circuit Design
|
| Published by |
Springer, Boston, MA, January 2010
|
| DOI | 10.1007/978-1-4419-0784-4_6 |
| Book ISBNs |
978-1-4419-0783-7, 978-1-4419-0784-4
|
| Authors |
Sachin S. Sapatnekar, Sapatnekar, Sachin S. |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| China | 1 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Professor > Associate Professor | 1 | 100% |
| Readers by discipline | Count | As % |
|---|---|---|
| Computer Science | 1 | 100% |