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Three Dimensional Integrated Circuit Design

Overview of attention for book
Cover of 'Three Dimensional Integrated Circuit Design'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction
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    Chapter 2 3D Process Technology Considerations
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    Chapter 3 Thermal and Power Delivery Challenges in 3D ICs
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    Chapter 4 Thermal-Aware 3D Floorplan
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    Chapter 5 Thermal-Aware 3D Placement
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    Chapter 6 Thermal Via Insertion and Thermally Aware Routing in 3D ICs
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    Chapter 7 Three-Dimensional Microprocessor Design
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    Chapter 8 Three-Dimensional Network-on-Chip Architecture
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    Chapter 9 PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
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    Chapter 10 System-Level 3D IC Cost Analysis and Design Exploration
Attention for Chapter 9: PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
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Citations

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