Advanced Wirebond Interconnection Technology

Overview of attention for book

Cover of 'Advanced Wirebond Interconnection Technology'

Table of Contents

Attention for Chapter 1: Introduction

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Citations

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So far, Dimensions has found 22 publications that cite this research output.

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Corrosion induced reliability degradation due to pad design variation

Conference proceeding (August 2019)

Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire

Article in Microelectronics Reliability (December 2018)

High Reliable Wire Bonding Technology in Microwave Module Packaging

Conference proceeding (August 2016)

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