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Advanced Wirebond Interconnection Technology

Overview of attention for book
Attention for Chapter 7: New Technologies and New Applications for Wire Bonding
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Citations

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22 Dimensions

Readers on

mendeley
2 Mendeley
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Chapter title
New Technologies and New Applications for Wire Bonding
Chapter number 7
Book title
Advanced Wirebond Interconnection Technology
Published by
Springer, Boston, MA, January 2004
DOI 10.1007/1-4020-7763-7_7
Book ISBNs
978-1-4020-7762-3, 978-1-4020-7763-0
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 2 100%

Demographic breakdown

Readers by professional status Count As %
Student > Bachelor 1 50%
Unknown 1 50%
Readers by discipline Count As %
Engineering 1 50%
Unknown 1 50%