Advanced Wirebond Interconnection Technology

Overview of attention for book

Cover of 'Advanced Wirebond Interconnection Technology'

Table of Contents

Attention for Chapter 4: Process Technology

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Citations

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So far, Dimensions has found 22 publications that cite this research output.

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The most recent citing publications are shown below. View all 22 publications that cite this research output on Dimensions.

Corrosion induced reliability degradation due to pad design variation

Conference proceeding (August 2019)

Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire

Article in Microelectronics Reliability (December 2018)

High Reliable Wire Bonding Technology in Microwave Module Packaging

Conference proceeding (August 2016)

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