Semiconductor Advanced Packaging

RT @ogawa_tter: => "Reliability Testing and Design for Reliability of Packaging Interconnects (Solder Joints)", John Lau, Unimicron, Tutori…

RT @ogawa_tter: => "Reliability Testing and Design for Reliability of Packaging Interconnects (Solder Joints)", John Lau, Unimicron, Tutori…

=> "Reliability Testing and Design for Reliability of Packaging Interconnects (Solder Joints)", John Lau, Unimicron, Tutorial, IEEE EPS Silicon Valley Area Chapter, Jan 5, 2023 (305 pp) https://t.co/Ad2C8k6VFM 2021 https://t.co/IL87TcrEtB Advanced Packa

=> "3D Microelectronic Packaging: From Architectures to Applications", Yan Li, & Deepak Goyal, Intel, 2021 https://t.co/LwKTaIdrSS 18 chapters, 622 pages A comprehensive reference guide for graduate students and professionals in both academia and in