Semiconductor Advanced Packaging
Springer Singapore
You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output.
Click here to find out more.
X Demographics
Mendeley readers
| Title |
Semiconductor Advanced Packaging
|
|---|---|
| Published by |
Springer Singapore, January 2021
|
| DOI | 10.1007/978-981-16-1376-0 |
| ISBNs |
978-9-81-161375-3, 978-9-81-161376-0
|
| Authors |
John H. Lau |
X Demographics
The data shown below were collected from the profiles of 3 X users who shared this research output. Click here to find out more about how the information was compiled.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 3 | 100% |
Demographic breakdown
| Type | Count | As % |
|---|---|---|
| Members of the public | 3 | 100% |
Mendeley readers
The data shown below were compiled from readership statistics for 62 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 62 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 13 | 21% |
| Researcher | 8 | 13% |
| Student > Master | 3 | 5% |
| Other | 2 | 3% |
| Student > Bachelor | 2 | 3% |
| Other | 3 | 5% |
| Unknown | 31 | 50% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 10 | 16% |
| Materials Science | 6 | 10% |
| Computer Science | 4 | 6% |
| Chemical Engineering | 3 | 5% |
| Physics and Astronomy | 2 | 3% |
| Other | 3 | 5% |
| Unknown | 34 | 55% |