Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint
Article in Microelectronic Engineering (July 2024)
The most recent citing publications are shown below. View all 72 publications that cite this research output on Dimensions.
Article in Microelectronic Engineering (July 2024)
Article in IEEE Transactions on Components Packaging and Manufacturing Technology (March 2024)
Article in Micromachines (March 2024)