Integrated circuit with vertical structures on nodes of a grid Grant US-11171142-B2 United States of America 09 Nov 2021
Microelectronic device with a memory element utilizing stacked vertical devices Grant US-11164879-B2 United States of America 02 Nov 2021
Buried conductive layer supplying digital circuits Grant US-10833089-B2 United States of America 10 Nov 2020
Microelectronic device utilizing stacked vertical devices Grant US-10804266-B2 United States of America 13 Oct 2020