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Mendeley readers
| Title |
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
|
|---|---|
| Published in |
Discover Nano, January 2017
|
| DOI | 10.1186/s11671-017-1831-4 |
| Pubmed ID | |
| Authors |
Wen-Wei Shen, Kuan-Neng Chen |
Mendeley readers
The data shown below were compiled from readership statistics for 125 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 125 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 21 | 17% |
| Student > Master | 17 | 14% |
| Researcher | 11 | 9% |
| Student > Bachelor | 8 | 6% |
| Student > Doctoral Student | 4 | 3% |
| Other | 9 | 7% |
| Unknown | 55 | 44% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 32 | 26% |
| Materials Science | 13 | 10% |
| Physics and Astronomy | 4 | 3% |
| Computer Science | 4 | 3% |
| Chemical Engineering | 3 | 2% |
| Other | 8 | 6% |
| Unknown | 61 | 49% |