Heterogeneous Integrations

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Cover of 'Heterogeneous Integrations'

Table of Contents

Attention for Chapter 11: Trends in Heterogeneous Integrations

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dimensions_citation: 44 Dimensions

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So far, Dimensions has found 44 publications that cite this research output.

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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Monograph (January 2024)

Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]

Article in IEEE Circuits and Systems Magazine (January 2024)

3D Monolithically Integrated Device of Si CMOS Logic, IGZO DRAM-like, and 2D MoS2 Phototransistor for Smart Image Sensing

Conference proceeding (December 2023)

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