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Mendeley readers
Chapter title |
A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites
|
---|---|
Chapter number | 30 |
Book title |
Bio and Nano Packaging Techniques for Electron Devices
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Published by |
Springer, Berlin, Heidelberg, January 2012
|
DOI | 10.1007/978-3-642-28522-6_30 |
Book ISBNs |
978-3-64-228521-9, 978-3-64-228522-6
|
Authors |
Jörg Hertwig, Holger Neubert, Jens Lienig |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
United States | 1 | 33% |
Unknown | 2 | 67% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Unspecified | 1 | 33% |
Professor | 1 | 33% |
Student > Ph. D. Student | 1 | 33% |
Readers by discipline | Count | As % |
---|---|---|
Unspecified | 1 | 33% |
Social Sciences | 1 | 33% |
Engineering | 1 | 33% |