Enhancing Die and Wire Bonding Process Reliability: Microstructure Evolution and Shear Strength Analysis of Sn-Sb Backside Metal
Article in Korean Journal of Materials Research (March 2024)
The most recent citing publications are shown below. View all 42 publications that cite this research output on Dimensions.
Article in Korean Journal of Materials Research (March 2024)
Article in Journal of Electronic Materials (November 2021)
Article in Journal of Wuhan University of Technology-Mater. Sci. Ed. (October 2019)