Three Dimensional Integrated Circuit Design
Springer US
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Timeline
Mendeley readers
| Chapter title |
Thermal-Aware 3D Placement
|
|---|---|
| Chapter number | 5 |
| Book title |
Three Dimensional Integrated Circuit Design
|
| Published by |
Springer, Boston, MA, January 2010
|
| DOI | 10.1007/978-1-4419-0784-4_5 |
| Book ISBNs |
978-1-4419-0783-7, 978-1-4419-0784-4
|
| Authors |
Jason Cong, Guojie Luo, Cong, Jason, Luo, Guojie |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Brazil | 1 | 33% |
| Unknown | 2 | 67% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Professor > Associate Professor | 1 | 33% |
| Student > Doctoral Student | 1 | 33% |
| Student > Master | 1 | 33% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 2 | 67% |
| Computer Science | 1 | 33% |