↓ Skip to main content
What is this page? Embed badge

Advanced Thermal Management Materials

Overview of attention for book
Cover of 'Advanced Thermal Management Materials'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 Introduction to Thermal Management in Microelectronics Packaging
  3. Altmetric Badge
    Chapter 2 Requirements of Thermal Management Materials
  4. Altmetric Badge
    Chapter 3 Overview of Traditional Thermal Management Materials
  5. Altmetric Badge
    Chapter 4 Development of Advanced Thermal Management Materials
  6. Altmetric Badge
    Chapter 5 Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies
  7. Altmetric Badge
    Chapter 6 Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
  8. Altmetric Badge
    Chapter 7 Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
  9. Altmetric Badge
    Chapter 8 AlSiC Thermal Management Materials
  10. Altmetric Badge
    Chapter 9 Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper
  11. Altmetric Badge
    Chapter 10 Future Trend of Advanced Thermal Management Materials
Attention for Chapter 6: Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
Altmetric Badge

Citations

dimensions_citation
39 Dimensions

Readers on

mendeley
1 Mendeley
Summary Dimensions citations
So far, Dimensions has found 39 publications that cite this research output.

39

The most recent citing publications are shown below. View all 39 publications that cite this research output on Dimensions.

This page shows the most recent citations of this research output.

Click here to find out how to access more activity.

This page is provided by Altmetric.