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3D Flash Memories

Overview of attention for book
Attention for Chapter 9: 3D Multi-chip Integration and Packaging Technology for NAND Flash Memories
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Citations

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2 Mendeley
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Chapter title
3D Multi-chip Integration and Packaging Technology for NAND Flash Memories
Chapter number 9
Book title
3D Flash Memories
Published by
Springer, Dordrecht, January 2016
DOI 10.1007/978-94-017-7512-0_9
Book ISBNs
978-9-40-177510-6, 978-9-40-177512-0
Authors

Herb Huang, Rino Micheloni

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 2 100%

Demographic breakdown

Readers by professional status Count As %
Student > Master 1 50%
Unknown 1 50%
Readers by discipline Count As %
Computer Science 1 50%
Unknown 1 50%