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| Chapter title |
TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
|
|---|---|
| Chapter number | 7 |
| Book title |
Three-Dimensional Integration of Semiconductors
|
| Published by |
Springer, Cham, January 2015
|
| DOI | 10.1007/978-3-319-18675-7_7 |
| Book ISBNs |
978-3-31-918674-0, 978-3-31-918675-7
|
| Authors |
Kangwook Lee, Mitsuma Koyanagi |