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Advances in Electronic Circuit Packaging

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Cover of 'Advances in Electronic Circuit Packaging'

Table of Contents

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    Book Overview
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    Chapter 1 Encapsulants for Electronic Packaging
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    Chapter 2 Use of Radiation-Cross-Linked Materials for Encapsulating and Terminating Devices
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    Chapter 3 Encapsulating with Loose Microballoons
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    Chapter 4 Packaging Concept for a Miniature Low-Light-Level TV Camera
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    Chapter 5 The Heat-Sink Module
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    Chapter 6 Producibility Norms for Electronic System Packaging
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    Chapter 7 Development of Packaging Techniques for a 960-Bit Plated-Wire Memory
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    Chapter 8 Packaging Computer Circuitry for Space Applications—A Two-Part Compendium
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    Chapter 9 A Cost and Performance Analysis of Encapsulation by Transfer Molding
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    Chapter 10 Packaging of Miniature Diode Assemblies
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    Chapter 11 Transfer Molding of Silicone Compounds for Environmental Protection of Electronic Modular Systems
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    Chapter 12 A Feasibility Study in Miniaturized Packaging
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    Chapter 13 Interconnection and Organization of Functional Electronic Blocks
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    Chapter 14 Designing for Multilayer Circuits
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    Chapter 15 A Flexible Module Concept for Electronic Box Design
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    Chapter 16 A High-Frequency Multiple-Signal-Conductor Transmission Line
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    Chapter 17 High-Frequency Interconnections
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    Chapter 18 Interconnection System
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    Chapter 19 Substitution of a Printed Conductor Ring Harness for a Conventional Cable Harness on the Mariner Series Spacecraft
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    Chapter 20 Design of Connectors for Electronic Packaging
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    Chapter 21 Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer
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    Chapter 22 Standard Package for Microcircuits
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    Chapter 23 Semiconductor Circuits and Modular Packaging
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    Chapter 24 A Packaging Evaluation of a Five-Bit Adder
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    Chapter 25 Radiation Effects in Epoxies Used as Encapsulants for Electronic Packages
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    Chapter 26 Designing a High-Voltage Power Supply for a Space Radar System
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Title
Advances in Electronic Circuit Packaging
Published by
Springer US, December 2013
DOI 10.1007/978-1-4899-7307-8
ISBNs
978-1-4899-7295-8, 978-1-4899-7307-8
Editors

Rosine, Lawrence L.