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Designing 2D and 3D Network-on-Chip Architectures

Overview of attention for book
Attention for Chapter 4: Power and Thermal Effects and Management
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Chapter title
Power and Thermal Effects and Management
Chapter number 4
Book title
Designing 2D and 3D Network-on-Chip Architectures
Published by
Springer, New York, NY, January 2014
DOI 10.1007/978-1-4614-4274-5_4
Book ISBNs
978-1-4614-4273-8, 978-1-4614-4274-5
Authors

Konstantinos Tatas, Kostas Siozios, Dimitrios Soudris, Axel Jantsch

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 1 100%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 1 100%
Readers by discipline Count As %
Computer Science 1 100%