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Interconnect-Centric Design for Advanced SoC and NoC

Overview of attention for book
Cover of 'Interconnect-Centric Design for Advanced SoC and NoC'

Table of Contents

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    Book Overview
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    Chapter 1 System-on-Chip-Challenges in the Deep-Sub-Micron Era
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    Chapter 2 Wires as Interconnects
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    Chapter 3 Global Interconnect Analysis
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    Chapter 4 Design Methodologies for on-Chip Inductive Interconnect
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    Chapter 5 Clock Distribution for High Performance Designs
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    Chapter 6 Error-Tolerant Interconnect Schemes
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    Chapter 7 Power Reduction Coding for Buses
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    Chapter 8 Bus Structures in Network-on-Chips
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    Chapter 9 From Buses to Networks
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    Chapter 10 Arbitration and Routing Schemes for on-Chip Packet Networks
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    Chapter 11 Self-Timed Approach for Noise Reduction in NoC Reduction in NoC
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    Chapter 12 Formal Communication Modeling and Refinement
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    Chapter 13 Network-Centric System-Level Model for Multiprocessor Soc Simulation
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    Chapter 14 Socket-Based Design Using Decoupled Interconnects
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    Chapter 15 Interconnect and Memory Organization in SOCs for Advanced Set-Top Boxes and TV
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    Chapter 16 A Brunch from the Coffee Table-Case Study in NoC Platform Design
Attention for Chapter 2: Wires as Interconnects
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Citations

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Summary Dimensions citations
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Chapter title
Wires as Interconnects
Chapter number 2
Book title
Interconnect-Centric Design for Advanced SoC and NoC
Published by
Springer, Boston, MA, January 2005
DOI 10.1007/1-4020-7836-6_2
Book ISBNs
978-1-4020-7835-4, 978-1-4020-7836-1
Authors

Li-Rong Zheng, Hannu Tenhunen, Zheng, Li-Rong, Tenhunen, Hannu

View on publisher site
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 5 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
United Kingdom 1 20%
Unknown 4 80%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 3 60%
Student > Bachelor 1 20%
Student > Doctoral Student 1 20%
Readers by discipline Count As %
Engineering 4 80%
Mathematics 1 20%

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