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Chapter title |
Photothermal Measurement of Metal Film Thickness in Integrated Circuit Devices
|
---|---|
Chapter number | 61 |
Book title |
Review of Progress in Quantitative Nondestructive Evaluation
|
Published by |
Springer, Boston, MA, January 1993
|
DOI | 10.1007/978-1-4615-2848-7_61 |
Book ISBNs |
978-1-4613-6233-3, 978-1-4615-2848-7
|
Authors |
Xiao-Dong Wu, Gordon S. Kino, Wu, Xiao-Dong, Kino, Gordon S. |