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| Chapter title |
Thermische Herausforderungen und ihre Berücksichtigung beim 3D-Entwurf
|
|---|---|
| Chapter number | 11 |
| Book title |
Entwurf integrierter 3D-Systeme der Elektronik
|
| Published by |
Springer, Berlin, Heidelberg, January 2012
|
| DOI | 10.1007/978-3-642-30572-6_11 |
| Book ISBNs |
978-3-64-230571-9, 978-3-64-230572-6
|
| Authors |
Holger Neubert, Neubert, Holger |