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Chapter title |
Shear Strength and Fracture Surface Studies of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging Under Isothermal Ageing
|
---|---|
Chapter number | 3 |
Book title |
Transactions on Engineering Technologies
|
Published by |
Springer, Dordrecht, January 2014
|
DOI | 10.1007/978-94-017-8832-8_3 |
Book ISBNs |
978-9-40-178831-1, 978-9-40-178832-8
|
Authors |
Sabuj Mallik, Ahmed Z. El Mehdawi, Mallik, Sabuj, Mehdawi, Ahmed Z. El |