Three Dimensional Integrated Circuit Design
Springer US
Chapter title |
Thermal and Power Delivery Challenges in 3D ICs
|
---|---|
Chapter number | 3 |
Book title |
Three Dimensional Integrated Circuit Design
|
Published by |
Springer, Boston, MA, January 2010
|
DOI | 10.1007/978-1-4419-0784-4_3 |
Book ISBNs |
978-1-4419-0783-7, 978-1-4419-0784-4
|
Authors |
Pulkit Jain, Pingqiang Zhou, Chris H. Kim, Sachin S. Sapatnekar, Jain, Pulkit, Zhou, Pingqiang, Kim, Chris H., Sapatnekar, Sachin S. |
Country | Count | As % |
---|---|---|
Switzerland | 1 | 14% |
Brazil | 1 | 14% |
Unknown | 5 | 71% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 6 | 86% |
Student > Doctoral Student | 1 | 14% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 5 | 71% |
Computer Science | 2 | 29% |