Handbook of Mechanics of Materials
Springer, Singapore
Chapter title |
Stress Measurement in Thin Films Using Wafer Curvature: Principles and Applications
|
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Chapter number | 49 |
Book title |
Handbook of Mechanics of Materials
|
Published by |
Springer, Singapore, January 2018
|
DOI | 10.1007/978-981-10-6855-3_49-1 |
Book ISBNs |
978-9-81-106855-3
|
Authors |
Eric Chason |