Synergistic enhancement of adhesion and electromigration reliability of cobalt via super-diluted (0.06 at.%) tungsten alloying as next-generation interconnect materials
Article in Microelectronics Reliability (July 2024)
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Article in Microelectronics Reliability (July 2024)
Conference proceeding (June 2024)
Article in Acta Materialia (May 2024)