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Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Overview of attention for article published in Discover Nano, November 2014
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Title
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
Published in
Discover Nano, November 2014
DOI 10.1186/1556-276x-9-643
Pubmed ID
Authors

Zifeng Wang, Yuqiao Fu, Wenjun Meng, Chunyi Zhi

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 42 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
United States 1 2%
Unknown 41 98%

Demographic breakdown

Readers by professional status Count As %
Student > Master 11 26%
Student > Ph. D. Student 6 14%
Student > Doctoral Student 4 10%
Student > Bachelor 4 10%
Researcher 3 7%
Other 4 10%
Unknown 10 24%
Readers by discipline Count As %
Materials Science 11 26%
Engineering 9 21%
Chemistry 7 17%
Chemical Engineering 2 5%
Medicine and Dentistry 1 2%
Other 0 0%
Unknown 12 29%