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Timeline
Chapter title |
Analysis and Experimental Validation of Solder Joints of CCGA Packages
|
---|---|
Chapter number | 16 |
Book title |
Advances in Small Satellite Technologies
|
Published by |
Springer, Singapore, January 2023
|
DOI | 10.1007/978-981-19-7474-8_16 |
Book ISBNs |
978-9-81-197473-1, 978-9-81-197474-8
|
Authors |
Chandrashekar, B. K., Joteppa, Santosh, Chippalkatti, Vinod |