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Chapter title |
A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process
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Chapter number | 118 |
Book title |
Proceeding of 2021 International Conference on Wireless Communications, Networking and Applications
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Published by |
Springer, Singapore, January 2022
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DOI | 10.1007/978-981-19-2456-9_118 |
Book ISBNs |
978-9-81-192455-2, 978-9-81-192456-9
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Authors |
Chen, Huiqun, Jin, Fenpin |