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Advanced Materials for Printed Flexible Electronics

Overview of attention for book
Attention for Chapter 5: Substrate and Encapsulation Materials for Printed Flexible Electronics
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Chapter title
Substrate and Encapsulation Materials for Printed Flexible Electronics
Chapter number 5
Book title
Advanced Materials for Printed Flexible Electronics
Published by
Springer, Cham, January 2022
DOI 10.1007/978-3-030-79804-8_5
Book ISBNs
978-3-03-079803-1, 978-3-03-079804-8
Authors

Tong, Colin

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 2 100%

Demographic breakdown

Readers by professional status Count As %
Professor 1 50%
Student > Master 1 50%
Readers by discipline Count As %
Materials Science 1 50%
Engineering 1 50%