3D Microelectronic Packaging
Springer Singapore
Chapter title |
3D Packaging Architectures and Assembly Process Design
|
---|---|
Book title |
3D Microelectronic Packaging
|
Published by |
Springer, Singapore, November 2020
|
DOI | 10.1007/978-981-15-7090-2_2 |
Book ISBNs |
978-9-81-157089-6, 978-9-81-157090-2
|
Authors |
Ravi Mahajan, Bob Sankman |
Country | Count | As % |
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Unknown | 2 | 100% |
Type | Count | As % |
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Members of the public | 2 | 100% |
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Postgraduate | 1 | 50% |
Unknown | 1 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Unknown | 2 | 100% |