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Timeline
Mendeley readers
Chapter title |
Coupling Mechanism and Optimization of THT Assembly Process Parameters Based on Flexible Soldering Robot Platform
|
---|---|
Chapter number | 90 |
Book title |
Proceedings of the Seventh Asia International Symposium on Mechatronics
|
Published by |
Springer, Singapore, January 2020
|
DOI | 10.1007/978-981-32-9437-0_90 |
Book ISBNs |
978-9-81-329436-3, 978-9-81-329437-0
|
Authors |
Tao Yu, Jikong Wang, Kehong Zhou, Junfeng Sun, Gengshe Yang, Zhanlong Qi, Yu, Tao, Wang, Jikong, Zhou, Kehong, Sun, Junfeng, Yang, Gengshe, Qi, Zhanlong |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Linguistics | 1 | 100% |