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Chapter title |
A Study on Improving Polishing Process Effectiveness for Silicon Reclaim Wafer
|
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Chapter number | 96 |
Book title |
Intelligent Technologies and Engineering Systems
|
Published by |
Springer, New York, NY, January 2013
|
DOI | 10.1007/978-1-4614-6747-2_96 |
Book ISBNs |
978-1-4614-6746-5, 978-1-4614-6747-2
|
Authors |
Chia-Pao Chang, Wei-Ling Wang, Yung-Ching Kuo, Chang, Chia-Pao, Wang, Wei-Ling, Kuo, Yung-Ching |