Three Dimensional System Integration
Springer US
Chapter title |
3D Through-Silicon Via Technology Markets and Applications
|
---|---|
Chapter number | 10 |
Book title |
Three Dimensional System Integration
|
Published by |
Springer, Boston, MA, January 2011
|
DOI | 10.1007/978-1-4419-0962-6_10 |
Book ISBNs |
978-1-4419-0961-9, 978-1-4419-0962-6
|
Authors |
E. Jan Vardaman |