Re-engineering Manufacturing for Sustainability
Springer Nature
Chapter title |
Developing a Parametric Carbon Footprinting Tool: A Case Study of Wafer Fabrication in the Semiconductor Industry
|
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Chapter number | 82 |
Book title |
Re-engineering Manufacturing for Sustainability
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Published by |
Springer, Singapore, January 2013
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DOI | 10.1007/978-981-4451-48-2_82 |
Book ISBNs |
978-9-81-445147-5, 978-9-81-445148-2
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Authors |
Allen H. Hu, Ching-Yao Huang, Jessica Yin, Hsiao-Chun Wang, Ting-Hsin Wang |
Country | Count | As % |
---|---|---|
Singapore | 1 | 14% |
Unknown | 6 | 86% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 2 | 29% |
Professor | 1 | 14% |
Student > Bachelor | 1 | 14% |
Student > Master | 1 | 14% |
Researcher | 1 | 14% |
Other | 0 | 0% |
Unknown | 1 | 14% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 3 | 43% |
Environmental Science | 2 | 29% |
Economics, Econometrics and Finance | 1 | 14% |
Unknown | 1 | 14% |