Reliability of Organic Compounds in Microelectronics and Optoelectronics
Springer International Publishing
Chapter title |
Manufacturing for Reliability of Panel-Level Fan-out Packages
|
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Chapter number | 16 |
Book title |
Reliability of Organic Compounds in Microelectronics and Optoelectronics
|
Published by |
Springer, Cham, January 2022
|
DOI | 10.1007/978-3-030-81576-9_16 |
Book ISBNs |
978-3-03-081575-2, 978-3-03-081576-9
|
Authors |
Braun, T., Hölck, O. |