Springer Handbook of Semiconductor Devices
Springer International Publishing
Chapter title |
Interconnect Processing: Integration, Dielectrics, Metals
|
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Chapter number | 5 |
Book title |
Springer Handbook of Semiconductor Devices
|
Published by |
Springer, Cham, January 2023
|
DOI | 10.1007/978-3-030-79827-7_5 |
Book ISBNs |
978-3-03-079826-0, 978-3-03-079827-7
|
Authors |
Chen, Shyng-Tsong, Lanzillo, Nicholas A., Van Nguyen, Son, Nogami, Takeshi, Simon, Andrew H. |
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 2 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 1 | 50% |
Unknown | 1 | 50% |