Artificial Intelligence Applications and Innovations
Springer International Publishing
Chapter title |
Prediction of Wafer Map Categories Using Wafer Acceptance Test Parameters in Semiconductor Manufacturing
|
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Chapter number | 12 |
Book title |
Artificial Intelligence Applications and Innovations
|
Published by |
Springer, Cham, January 2022
|
DOI | 10.1007/978-3-031-08337-2_12 |
Book ISBNs |
978-3-03-108336-5, 978-3-03-108337-2
|
Authors |
Lim, Martin Ying Song, Sharma, Anurag, Chin, Cheng Siong, Yip, Tommy Chun Ming, Ong, Jonathan Yoong Seang |